作者: Syuichi Azechi
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摘要: A thermosetting composition comprising (A) an organopolysiloxane and (B) a curing catalyst, characterized in that the has at least two alkenyl groups per molecule phenyl group amount of from 10 to 99% whole substituents bonded silicon atoms organopolysiloxane, softens or melts temperature 30° C. lower than onset heat composition.