High temperature sensor wafer for in-situ measurements in active plasma

摘要: Aspects of the present disclosure disclose a component module in process condition measuring device comprises support for supporting component, one or more legs configured to suspend spaced-apart relationship with respect substrate. An electrically conductive low-resistivity semiconductor enclosure is enclose and between substrate enclosure. It emphasized that this abstract provided comply rules requiring an will allow searcher other reader quickly ascertain subject matter technical disclosure. submitted understanding it not be used interpret limit scope meaning claims.