Micromechanical device and method of manufacturing micromechanical device

作者: Yoshiaki Sugizaki , Susumu Obata , Takeshi Miyagi , Michinobu Inoue

DOI:

关键词: Moisture permeabilityForensic engineeringDeformation (engineering)Materials scienceComposite materialSubstrate (printing)

摘要: A micromechanical device according to an aspect of the present invention includes, a substrate, micromachine which is mounted on provided with mechanism deformed by function electric field, and changes electrical characteristics concomitantly deformation, inner inorganic sealing film contains material, principal surface covers through hollow section containing gaseous body therein, opening shape sections allowing communicate outside, organic formed film, blocks up sections, outer material lower moisture permeability than film.

参考文章(18)
Valluri Rao, John Heck, Michele Berry, Daniel Wong, Packaging microelectromechanical systems ,(2003)
Sanjar Ghaem, Andrew Skipor, Daniel Gamota, Aroon Tungare, Marc Chason, Micro-electro mechanical system ,(2001)
Aaron Partridge, Markus Lutz, Silvia Kronmueller, Microelectromechanical systems, and methods for encapsulating and fabricating same ,(2004)
Christopher V. Jahnes, Bruce K. Furman, Evan G. Colgan, Apparatus and methods for encapsulating microelectromechanical (MEM) devices on a wafer scale ,(2004)
Susumu Obata, Michinobu Inoue, Takeshi Miyagi, Ikuo Mori, Yoshiaki Sugizaki, Yoshiaki Shimooka, Akihiro Kojima, Mitsuyoshi Endo, Hideki Shibata, In-line wafer level hermetic packages for MEMS variable capacitor electronic components and technology conference. pp. 158- 163 ,(2008) , 10.1109/ECTC.2008.4549963
Stephen P. A. Fodor, Rolfe C. Anderson, Robert J. Lipshutz, Richard P. Rava, Miniaturized genetic analysis systems and methods ,(2000)
David I. Forehand, Charles L. Goldsmith, Wafer Level Micropackaging for RF MEMS Switches Advances in Electronic Packaging, Parts A, B, and C. pp. 2047- 2051 ,(2005) , 10.1115/IPACK2005-73398