Microelectromechanical systems, and methods for encapsulating and fabricating same

摘要: Abstract not available for EP1634328Abstract of corresponding document: US2004248344There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, technique fabricating or manufacturing having mechanical structures encapsulated in chamber prior final packaging. The material that encapsulates structures, when deposited, includes more following attributes: low tensile stress, good step coverage, maintains its integrity subjected subsequent processing, does significantly and/or adversely impact performance characteristics (if coated with during deposition), facilitates integration high-performance integrated circuits. embodiment, is, example, silicon (polycrystalline, amorphous porous, whether doped undoped), carbide, silicon-germanium, germanium, gallium-arsenide.