Hollow sealing structure and manufacturing method for hollow sealing structure
作者： Susumu Obata , Tatsuya Ohguro
DOI:
关键词: Composite material 、 Substrate (printing) 、 Layer removal 、 Materials science 、 Layer (electronics)
摘要: A manufacturing method for a hollow sealing structure, includes, process filling recessed portion in principal surface of substrate with first sacrificial layer, forming functional element on the substrate, second layer so as to be connected part covering over respective surfaces and layers, circulating fluid removal through an opening contact thereby removing closing opening.
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