High temperature microelectromechanical (MEM) devices and fabrication method
作者： Philip A. Stupar , Robert L. Borwick , Jeffrey F. DeNatale
DOI:
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摘要: A microelectromechanical (MEM) device per the present invention comprises a semiconductor wafer - typically an SOI wafer, substrate, and high temperature bond which bonds to substrate form composite structure. Portions of structure are patterned etched define stationary movable MEM elements, with elements being mechanically coupled elements. The is preferably mechanical bond, having respective bonding pads aligned connected thermocompression effect bonding. metallization layer deposited on provide electrical interconnections for device. conductive refractory material such as platinum withstand environments .
lens.org 参考文章(14)
Robert E. Higashi, Ernest A. Satren, Method of thermally coupling a flow tube or like component to a thermal sensor and sensor systems formed thereby ,(2005)
Chialun Tsai, Process for high yield fabrication of MEMS devices ,(2002)
Deok Hoon Kim, Hwan Chul Lee, Electronic package for image sensor, and the packaging method thereof ,(2005)
William C. Tang, Roger T. Howe, Laterally driven resonant microstructures ,(1989)
Frank S. Geefay, Tracy E. Bell, Yogesh M. Desai, Richard C. Ruby, Microcap wafer-level package ,(2000)
Robert Borwick, Jeffrey DeNatale, Lorentz force microelectromechanical system (MEMS) and a method for operating such a MEMS ,(2002)
Randall L. Kubena, Frederic P. Stratton, David T. Chang, Cloverleaf microgyroscope with through-wafer interconnects and method of manufacturing a cloverleaf microgyroscope with through-wafer interconnects ,(2004)
Andrew G. Huibers, Satyadev R. Patel, Steven S. Chiang, Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates ,(2005)
Frank S. Geefay, Tracy E. Bell, Richard C. Ruby, Yogesh M. Desai, Microcap wafer-level package with vias ,(2000)
Thomas F. Marinis, Jerome B. Sohn, Richard P. Tumminelli, Integrated packaging of micromechanical sensors and associated control circuits ,(2000)