In-line wafer level hermetic packages for MEMS variable capacitor
作者： Susumu Obata , Michinobu Inoue , Takeshi Miyagi , Ikuo Mori , Yoshiaki Sugizaki
DOI: 10.1109/ECTC.2008.4549963
关键词: Capacitor 、 Electronic engineering 、 Wafer 、 Atmospheric pressure 、 Packaging engineering 、 Variable capacitor 、 Optoelectronics 、 Wafer-scale integration 、 Microelectromechanical systems 、 Electronic packaging 、 Materials science
摘要: In this paper, we report in-line wafer level hermetic packages (WLP) for MEMS variable capacitors. The beam structure of vibrates strongly under decompression. Since vibration causes RF noise, it is necessary to set the pressure around at 40000Pa or greater. Therefore, a that carries out resin seal hole etching cap formed in sacrificial layer process, atmospheric (101300Pa) crucial what. To prevent moisture permeation inside cap, was coated with PECVD SiN layer. developed become hybrid encapsulation, which consists layers. Moreover, deformation by external reduced using corrugated cap. package comparatively large (340 times 1100 mum). Nevertheless, after 265degC reflow test (5 times) and -55degC/125degC thermal cycle (20 cycles), no cracks were observed packages. all such processes materials are compatible CMOS has very low cost. We present summary several aspects our development activities capacitor packaging technology.
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