A composite nature of cyclic strain accommodation mechanisms of accumulative roll bonding (ARB) processed Cu sheet materials
作者： Charles C.F. Kwan , Zhirui Wang
DOI: 10.1016/J.MSEA.2010.11.018
关键词:
摘要: A systematic investigation of the cyclic deformation behavior OFHC copper processed by 7 cycles accumulative roll bonding has been carried out. The ARB shows a unique composite natured microstructure with components various grain sizes. Upon deformation, general softening trend was observed. Due to microstructure, several micro-mechanisms have observed activated for strain accommodation. These mechanisms were found be in sequence rather than concurrently. first activate is believed slip pre-existing large equiaxed grains. Following exhaustion above, shear bands re-activated and further developed. It that incompatibility between grains within band those outside partially responsible coarsening along bands. related path localization. However, due limited ductility abundance crack nucleation sites, lifespan this material not long enough extensive necessary development macro band. In an attempt understand observed, consideration using model also discussed.
core.ac.uk
elsevier.com
sci-hub.se 参考文章(23)
S.D. Wu, Z.G. Wang, C.B. Jiang, G.Y. Li, I.V. Alexandrov, R.Z. Valiev, The formation of PSB-like shear bands in cyclically deformed ultrafine grained copper processed by ECAP Scripta Materialia. ,vol. 48, pp. 1605- 1609 ,(2003) , 10.1016/S1359-6462(03)00141-6
Seong Hee Lee, Seung Zeon Han, Cha Yong Lim, Nano-Structured High Purity Copper Processed by Accumulative Roll-Bonding Key Engineering Materials. ,vol. 317-318, pp. 239- 242 ,(2006) , 10.4028/WWW.SCIENTIFIC.NET/KEM.317-318.239
Naoki Takata, Kousuke Yamada, Kenichi Ikeda, Fuyuki Yoshida, Hideharu Nakashima, Nobuhiro Tsuji, Annealing Behavior and Recrystallized Texture in ARB Processed Copper Materials Science Forum. pp. 919- 924 ,(2006) , 10.4028/WWW.SCIENTIFIC.NET/MSF.503-504.919
S. R. Agnew, A. Yu. Vinogradov, S. Hashimoto, J. R. Weertman, Overview of fatigue performance of Cu processed by severe plastic deformation Journal of Electronic Materials. ,vol. 28, pp. 1038- 1044 ,(1999) , 10.1007/S11664-999-0181-0
T. J. Rupert, D. S. Gianola, Y. Gan, K. J. Hemker, Experimental observations of stress-driven grain boundary migration. Science. ,vol. 326, pp. 1686- 1690 ,(2009) , 10.1126/SCIENCE.1178226
M.V. Glazov, C. Laird, Size effects of dislocation patterning in fatigued metals Acta Metallurgica Et Materialia. ,vol. 43, pp. 2849- 2857 ,(1995) , 10.1016/0956-7151(94)00463-R
P. LUKÁŠ, L. KUNZ, M. SVOBODA, Effect of Low Temperature on Fatigue Life and Cyclic Stress-Strain Response of Ultrafine-Grained Copper Metallurgical and Materials Transactions A-physical Metallurgy and Materials Science. ,vol. 38, pp. 1910- 1915 ,(2007) , 10.1007/S11661-007-9108-7
Ning Wang, Zhirui Wang, K.T. Aust, U. Erb, Effect of grain size on mechanical properties of nanocrystalline materials Acta Metallurgica Et Materialia. ,vol. 43, pp. 519- 528 ,(1995) , 10.1016/0956-7151(94)00253-E
Seung Zeon Han, Masahiro Goto, Chayong Lim, Chang Joo Kim, Sangshik Kim, Fatigue behavior of nano-grained copper prepared by ECAP Journal of Alloys and Compounds. ,vol. 434, pp. 304- 306 ,(2007) , 10.1016/J.JALLCOM.2006.08.179
M GOTO, S HAN, T YAKUSHIJI, S KIM, C LIM, Fatigue strength and formation behavior of surface damage in ultrafine grained copper with different non-equilibrium microstructures International Journal of Fatigue. ,vol. 30, pp. 1333- 1344 ,(2008) , 10.1016/J.IJFATIGUE.2007.11.001