Effect of Low Temperature on Fatigue Life and Cyclic Stress-Strain Response of Ultrafine-Grained Copper
作者： P. LUKÁŠ , L. KUNZ , M. SVOBODA
DOI: 10.1007/S11661-007-9108-7
关键词: Dislocation 、 Grain boundary 、 Copper 、 Surface layer 、 Cyclic stress 、 Materials science 、 Shear (sheet metal) 、 Structural material 、 Metallurgy 、 Volume (thermodynamics)
摘要: Fatigue life curves and cyclic stress-strain of ultrafine-grained (UFG) copper purity 99.9 pct produced by equal-channel angular pressing (ECAP) were determined under stress control at room temperature (RT) a 173 K. The obtained compared to the corresponding on conventional-grain (CG) copper. At both temperatures, lifetime UFG is longer than that CG S-N curve dependent, while its insensitive. To explain this effect, two mechanisms plastic deformation proposed: temperature-independent bulk dislocation mechanism taking place in entire loaded volume temperature-dependent localized consisting cooperative grain boundary (GB) sliding along shear plane last ECAP pass surface layer leading formation fatigue markings.
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