Multi-scale modeling of the viscoplastic response of As-fabricated microscale Pb-free Sn3.0Ag0.5Cu solder interconnects

摘要: Abstract A mechanistic multiscale modeling framework is proposed, to capture the dominant creep mechanisms and influence of key microstructural features on measured secondary response microscale as-fabricated Sn3.0Ag0.5Cu (SAC305) solder interconnects. Mechanistic models dislocation climb detachment are used dispersion strengthening in Sn–Ag eutectic phase. These combined at next length scale, with micromechanics-based homogenization schemes, load-sharing between Sn dendrites intermetallic phases. The higher scale (Sn grains) not addressed here since empirically found be insensitive grain microstructure. Theoretical insights into viscoplastic behavior SAC305 interconnects provided. model effectively captures effect alloy composition aging loads SAC solders, thereby aiding effective design optimization alloys.