Galvanic Stimulation of Corrosion on Lead-Tin Solder-Sweated Joints

摘要: This article applies mixed-couple theory to the electrochemistry of Pb-Sn soldercopper joint and describes a technique for evaluating corrosion acceleration that is induced by galvanic stimulation. The theoretical underpinnings analysis are developed, along with an innovative analytical procedure makes verification predicted currents possible. normal exposure soldered water flow rapidly passivates solder surface limits action. After few days, ratio copper minimal consequence surface. pH important parameter in determining rate extent passivation surface, as presence orthophosphate inhibitors. Chlorine residuals little importance process. research relates proposed treatment procedures minimize lead release.