Improved monitoring of corrosion processes
作者： Russell L. Porter , John F. Ferguson
DOI: 10.1002/J.1551-8833.1995.TB06454.X
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摘要: The effect of orthophosphate addition (1 mg/L as P) on copper and lead-tin solder corrosion was monitored using an experimental coupon exposure apparatus with measurement by standing water metals analysis, gravimetric direct galvanic current metering, potentiodynamic scan analysis. Orthophosphate appeared to have a significant although the results each analysis differed in magnitude. less clear showing effect, whereas release showed only slight effect.
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