Semiconductor device fabricated by flux-free soldering
作者： Abdul Rahman Mohamed , Chu Hua Goh
DOI:
关键词:
摘要: A method of fabricating a semiconductor device is disclosed. In one aspect, the includes placing first chip on carrier with main surface facing carrier. layer soft solder material provided between and Heat applied during so that temperature at equal to or higher than melting material. second contact area surface. The layers are cooled solidify materials.
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