A Low-Temperature SU-8 Based Wafer-Level Hermetic Packaging for MEMS Devices
作者： I. Zine-El-Abidine , M. Okoniewski
DOI: 10.1109/TADVP.2008.2006757
关键词:
摘要: We have developed a novel all SU-8 packaging method for microelectromechanical system (MEMS) devices. The process is low temperature and cost it allows nonhermetic as well hermetic packaging. package can be applied to sensors. flow based on partial full exposure of negative resist using two masks. underexposed region results in cross-linking only surface layer, while the underlying not cross-linked removed developer. By depositing second layer sealed MEMS devices achieved. provides any pattern cavity clearance since solely lithography steps. concept introduced this paper then its practical validity demonstrated simulation characterization results.
sci-hub.se 参考文章(15)
Marc J. Madou, Fundamentals of microfabrication : the science of miniaturization CRC Press. ,(2002)
Chingfu Tsou, Hungchung Li, Hsing-Cheng Chang, A Novel Wafer-Level Hermetic Packaging for MEMS Devices IEEE Transactions on Advanced Packaging. ,vol. 30, pp. 616- 621 ,(2007) , 10.1109/TADVP.2007.906236
A J Gallant, D Wood, Surface micromachined membranes for wafer level packaging Journal of Micromechanics and Microengineering. ,vol. 15, ,(2005) , 10.1088/0960-1317/15/7/007
L. Lin, MEMS post-packaging by localized heating and bonding IEEE Transactions on Advanced Packaging. ,vol. 23, pp. 608- 616 ,(2000) , 10.1109/6040.883749
K.S. Lebouitz, A. Mazaheri, R.T. Howe, A.P. Pisano, Vacuum encapsulation of resonant devices using permeable polysilicon international conference on micro electro mechanical systems. pp. 470- 475 ,(1999) , 10.1109/MEMSYS.1999.746874
M. Bartek, J.A. Foerster, R.F. Wolffenbuttel, Vacuum sealing of microcavities using metal evaporation Sensors and Actuators A-physical. ,vol. 61, pp. 364- 368 ,(1997) , 10.1016/S0924-4247(97)80290-7
C-T Pan, H Yang, S-C Shen, M-C Chou, H-P Chou, A low-temperature wafer bonding technique using patternable materials Journal of Micromechanics and Microengineering. ,vol. 12, pp. 611- 615 ,(2002) , 10.1088/0960-1317/12/5/315
S Seok, N Rolland, P-A Rolland, Packaging methodology for RF devices using a BCB membrane transfer technique Journal of Micromechanics and Microengineering. ,vol. 16, pp. 2384- 2388 ,(2006) , 10.1088/0960-1317/16/11/019
L. Lin, C.T.-C. Nguyen, R.T. Howe, A.P. Pisano, Microelectromechanical filters for signal processing international conference on micro electro mechanical systems. ,vol. 7, pp. 286- 294 ,(1992) , 10.1109/MEMSYS.1992.187722
Chiung-Wen Lin, Hsueh-An Yang, Wei Chung Wang, Weileun Fang, Implementation of three-dimensional SOI-MEMS wafer-level packaging using through-wafer interconnections Journal of Micromechanics and Microengineering. ,vol. 17, pp. 1200- 1205 ,(2007) , 10.1088/0960-1317/17/6/014