A Novel Wafer-Level Hermetic Packaging for MEMS Devices

摘要: Some emerging microelectromechanical systems (MEMS) devices such as high-performance inertial sensors and high-speed actuators must be operated in a high vacuum order to create this environment, specific packaging is required. To satisfy demand, paper presents novel method for hermetic near-vacuum of MEMS devices. We use wafer-level bonding technology combine with packaging, simultaneously. For solution, the wafers air-guided micro-through-holes were placed on custom-built design housed chamber maintained at low-pressure environment sub-10 mtorr. Packaging structure then sealed by solder ball reflow process lower heating temperature 300degC fill up micro-through-hole. Experimental results shown hermetical technique using sealing adapted microfabrication can achieve better yield performance. Thus, very useful many applications performance low cost obtained due processing.