Liquid Encapsulation by Bonding-in-Liquid Technique

摘要: We propose and demonstrate Bonding-in-Solution Technique (BiST) for encapsulation of liquid in MEMS devices. Liquid enables innovative devices with various functions, such as hydraulic displacement amplification scanning mirrors. Interfusion air bubbles leakage the encapsulated must be averted not to deteriorate device performances. Several processes have been proposed, parylene deposition polymer thermal bonding. However, they involve vacuum and/or cannot applied volatile liquids. In BiST, two structural layers are passively aligned brought into contact solution, where cavities uniformly filled up without bubbles. A UV-curable resin is used an adhesive that does require heat or environment but UV bond layers. The detail BiST (a)UV-curable coated onto bonding surface a layer. layer contains only encapsulating also concave-shaped structures following passive alignment. (b) other convex-shaped when by matching concave convex structures. (c) light irradiated permanently bonded while maintained jig. successfully achieved DI water glycerin PDMS silicon No remains interface. Since conventional aligners applicable we experimentally evaluated accuracy alignment process solution makes use cylinders (concave) (convex) evaluate BiST. height depth designed elastically deform contact. elastic averaging investigated respect number pairs concave/convex improved increased did show correlation. 5μm was 12 ultimate goal our research develop liquid, mechanism tactile display. Glycerin largely-deformable-PDMS thin membranes using at input amplified output associated ratio cross-sectional areas.