An in situ scanning tunnelling microscopy study of bulk copper deposition and the influence of an organic additive

摘要: Abstract In situ scanning tunnelling microscopy (STM) was used to study the electrodeposition of copper onto Au(111) and Au(100) electrodes from sulphuric perchloric acid electrolytes. We also followed deposition in presence crystal violet, which has properties typical additives metal plating baths. For both crystallographic orientations, with or without additive, very initial stages electrocrystallization occurred predominantly at surface defects, such as step edges substrate surface. absence additive crystallites grew three dimensions number growth centres remained relatively constant, implying an instantaneous nucleation mechanism. However, small quantities violet electrolyte solution markedly influenced crystallites, on substrates. Instead growing they spread essentially parallel surface, produce films were much smoother microscopic scale.