Heat treatment apparatus and method

作者: Wataru Ohkase

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摘要: A heat treatment apparatus comprising rays radiating means having a sheet-like section, process tube radiated and heated by shot from the for carrying substrate, which has surface of semiconductor film and/or dielectric to be treated, into out tube, wherein said substrate is positioned section in such way that incident angle onto peripheral portion treated becomes smaller than 60°, so absorptivity at can increased.

参考文章(9)
Takuji Torii, Kazuo Honma, Toshihiro Komatsu, Tomoji Watanabe, Tetsuya Takagaki, Toshiyuki Uchino, Hiroto Nagazomo, Akihiko Sakai, Shigeki Hirasawa, Apparatus and method for performing heat treatment on semiconductor wafers ,(1988)
Wataru Okase, Yasushi Yagi, Satoshi Kawachi, Heat treatment method and apparatus thereof ,(1994)
Tsuyoshi Wakabayashi, Shigehito Ibuka, Method and apparatus for heat-treating a substrate ,(1989)