Effects of anisotropy of tin on grain orientation evolution in Pb-free solder joints under thermomechanical stress

摘要: In this paper, the grain orientation evolution of Pb-free solder joints during thermomechanical fatigue (TMF) was characterized quantitatively using in-situ electron backscattered diffraction (EBSD) observation, which an effective way to clarify mechanism recrystallization. The results showed that significantly affected by anisotropy β-tin grains. Recrystallization behavior a joint TMF very sensitive location boundaries and orientations in joints. Substantial stress could build up at real micro-electronic applications under stress, leading premature failures. Also, slip systems were clarified playing important role recrystallization be used predict subgrain recrystallized formation. While it conventional cognitive, tricrystals less likely develop cracks had longer lifetime than single-crystal However, for tricrystal with particularly undesirable orientations, (1 0 1)[1 \(\bar{1}\) ] 1)[\(\bar{1}\) 1] silp activated failures occurred internal caused anisotropic responses.