PF-bonded particleboards from AKD-modified chips
作者： Ulrich Hundhausen , Holger Militz , Carsten Mai
DOI: 10.1007/S00107-009-0358-5
关键词:
摘要: Alkyl ketene dimer (AKD) was used as a hydrophobic agent for PF-bonded particleboards. In contrast to conventionally paraffin, AKD can be covalently bonded the chip surface by esterification with wood hydroxyl groups. FTIR analyses before and after toluene extractions indicated that only small amount of applied is chemically bonded. Wettability studies on veneer strips suggested particularly accounts hydrophobicity.
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