Use of alkyl ketene dimer (AKD) for surface modification of particleboard chips
作者： Ulrich Hundhausen , Holger Militz , Carsten Mai
DOI: 10.1007/S00107-008-0275-Z
关键词:
摘要: The study objective was to impart urea-formaldehyde (UF) bonded particleboards higher and longer-lasting hydrophobicity than that resulting from conventionally used paraffin. Alkyl ketene dimer (AKD) is a paper sizing agent can theoretically esterify wood compounds result in surface modification. Particles were 1) impregnated with an aqueous AKD-solution cured at 130 °C prior gluing, or 2) sprayed mixture of UF-resin single step. Boards without paraffin wax as controls. Thickness swelling after 2, 24, 48 h immersion decreased by 90, 62, 59% when the chips AKD comparison untreated control boards. Water uptake reduced 91, 75, 60%. AKD-impregnation subsequent curing internal bond strength 53%, indicating impedes adhesion. UF-glue did not considerable hydrophobicity. Increased methyl/methylene carbonyl bands FTIR-spectra toluene-extraction suggest partially formed ester bonds surface.
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