Copper-base alloy cleaning solution

作者： Andrew J. Brock

DOI:

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摘要: The present invention relates to a cleaning solution for removing surface oxides from copper base alloys without significantly etching the copper-base alloy material. comprises about 1 v/o 50 hydrofluoric acid and 5 of at least one sulfuric hydrochloric acid. In preferred embodiment, consists essentially 15 25 balance water.

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