Method and apparatus for active particle and contaminant removal in wet clean processes in semiconductor manufacturing

摘要: An apparatus and a method for cleaning wafer are described. A chamber has substrate support. nozzle is disposed above the support to spray de-ionized water droplets. The coupled source of nitrogen. configured mix nitrogen outside have independent flow rate control two fluids an optimized atomization in terms uniformity droplet size velocity distributions. distance can be adjusted tuned jet efficiently removing particles or contaminants from surface without causing any feature damage.