Testing apparatus for non-packaged semiconductor chip
作者： Young Ho Kim , Hwa Jin Jeong
DOI:
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摘要: A non-packaged semiconductor chip testing apparatus includes a lead frame having chips with plurality of leads which are electrically isolated from the other leads, and supported by adhesive tape bonded to via wires. The is placed on holding plate windows, so that exposed through windows contact test probes located under plate. probes, such as pogo pins or bending extend upwardly substrate. base receives substrate, cables extending lower surface substrate passing openings in base, where they then connect board. After being pressed down pressing cover, moves may probes. cover movable up down. Guide simultaneously inserted into holes frame, recesses ensure alignment.
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