CUSHIONING THERMAL CONDUCTIVE MATERIAL

摘要: PROBLEM TO BE SOLVED: To keep a thermal resistance constant without being affected by compressivility, covering facing surface and part of side or front cushioning sheet piece with metal foil. SOLUTION: With upper lower surfaces (facing surfaces) 11 12 one 13 1 covered, the foil 2 are bonded together bonding agent. Connection between heat-generating semiconductor chip 4 mounted on substrate 3 cabinet 5 is thermally conductive, conduction R provided R=rX/(r+X) where r X piece. A r=r1 +r2 r1 contact at an interface upper/lower flat opposite r2 series part. Since almost even when compresivility conductive material changes while constant, compressivility.