Apparatus for processing a surface of substrate and method operating the apparatus
作者： Mikko Söderlund , Leif Keto , Pekka Soininen
DOI:
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摘要: The invention relates to an apparatus for processing a surface of the substrate (1, 101) by atomic layer deposition and method operating apparatus. comprising chamber (4) one or more lead-through connections (13, 15, 16) provided between side chambers (12, 42, 52, 112) (4). lead through comprises lead- (18) secondary pressure device (20) operatively connected (18).
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