Thermoplastic polyamide molding materials

摘要: Thermoplastic molding materials contain A) from 5 to 94% by weight of a partly aromatic, semicrystalline copolyamide composed essentially 1 ) 30 44 mol % units which are derived terephthalic acid, 2 6 20 isophthalic 3 43 49.5 hexamethylenediamine, and 4 0.5 7 aliphatic cyclic diamines carbon atoms, the molar percentages components together giving 100% B) an ASA or ABS SAN polymer C -C 18 -alkyl ester (meth)acrylic acid mixture thereof, C) 30% adhesion promoter contains 0.1 10% weight, based on (C), functional monomers, D) 0 elastomeric polymer, E) 45% fibrous particulate filler F) conventional additives processing assistants, summing 100%.