Investigation of electrical programmable metal fuse in 28nm and beyond CMOS technology
作者： Kuei-Sheng Wu , Ching-Hsiang Tseng , Chang-Chien Wong , Sinclair Chi , Titan Su
DOI: 10.1109/IITC.2011.5940312
关键词:
摘要: Minimum blowing current and thermal reliability of metal fuse were studied on various lengths top bottom line. By optimizing the length line, programming window can be extended. Next to optimize enough void size formed by thermally assisted electro-migration obtained in line is far away from via enabling highly stable operation. We think technology indispensable for 28nm node beyond with introduction gate/high-k process.
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