A stack/trench diode for use with a multi-state material in a non-volatile memory cell

作者: Fernando Gonzales , Ray Turi

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摘要: The invention provides a vertically oriented diode for use in delivering large amounts of current to variable resistance element multi-state memory cell. vertical is disposed container (20) extending downwardly from the top tall oxide stack into deep trench single crystal silicon. formed combination and/or polycrystalline silicon layers (22, 24) inside container. above complete construction surface area capable generating very flow through element, as required programming. In this way, highly effective can be created without requiring substrate space normally associated with such diodes.

参考文章(41)
David Stanasolovich, Ronald A. Warren, Donna R. Cote, Process for fabricating self-aligned contact studs for semiconductor structures ,(1992)
Stanford R. Ovshinsky, Wolodymyr Czubatyj, Stephen J. Hudgens, David A. Strand, Qiuyi Ye, Jesus Gonzalez-Hernandez, Hellmut Fritzsche, Benjamin S. Chao, Sergey A. Kostylev, Homogeneous compositions of microcrystalline semiconductor material, semiconductor devices and directly overwritable memory elements fabricated therefrom, and arrays fabricated from the memory elements ,(1991)
R Laibowitz, K Park, J Cuomo, J Cole, Bistable resistance device which does not require forming ,(1971)
Amr M. Mohsen, Esmat Z. Hamdy, John L. McCollum, Selectively formable vertical diode circuit element ,(1986)
George E. Ganschow, Ali A. Iranmanesh, Polysilicon Schottky clamped transistor and vertical fuse devices ,(1990)
Alexander Moopen, Anilkumar P. Thakoor, John Lambe, Thin film memory matrix using amorphous and high resistive layers ,(1986)
Stanford R. Ovshinsky, Napoleon P. Formigoni, Roger W. Pryor, Thin film overvoltage protection device ,(1987)
Tarsaim L. Batra, Sun Chiao, Chen Wang, Thin oxide fuse ,(1986)