作者: A. Verma , A. Chatterjee , B. Bhuva , E.D. Jansen
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摘要: Barriers to the industrial implementation of optical interconnects on an IC, center around fabrication elements wafers through conventional Si processes. This paper focuses demonstrating all Si-based interconnect system that can be easily integrated into a process. Most other approaches for use emitters require drastic changes in In this work, we demonstrate ability transmit electrical signals using i.e. light was generated by biasing LED at avalanche breakdown voltage, coupled fiber cable made SiO/sub 2/ and inserted based photo-diode. Results presented switching behavior GHz range, transmission signal across fiber, measurement limited BW receiver amplifier.