SYSTEMS FOR TREATING A SUBSTRATE

作者: Ahn Tae-Hyuk , Park Don-Ggun , Kim Bong-Sun , Lee Sang-Woun , Kim Ki-Sang

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摘要: The present inventive concept provides a substrate treating system. system has plurality of process facilities and at least one buffer station. Each the respectively includes transfer module in which robot is provided connected to module. A station located between each adjacent modules. stations are substrates first facility on side an imaginary connection line along direction modules arranged second line. further protrudes toward farther than facility.

参考文章(1)
Peter van der Meulen, Christopher C Kiley, Raymond S. Ritter, Thomas A. Schaefer, Patrick D. Pannese, Semiconductor wafer handling and transport ,(2008)