作者: Peter van der Meulen , Christopher C Kiley , Raymond S. Ritter , Thomas A. Schaefer , Patrick D. Pannese
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摘要: Modular wafer transport and handling facilities are combined in a variety of ways deliver greater levels flexibility, utility, efficiency, functionality vacuum semiconductor processing system. Various other modules may be interconnected with tunnel-and-cart transportation systems to extend the distance versatility environment. Other improvements such as bypass thermal adjusters, buffering aligners, batch processing, multifunction modules, low particle vents, cluster cells, like incorporated expand improve efficiency.