Device and method for bonding substrates
作者： Bernhard Rebhan
DOI:
关键词: Group (periodic table) 、 Optoelectronics 、 Structural engineering 、 Substrate (printing) 、 Materials science
摘要: The invention relates to a device for bonding face of first substrate second substrate, the having features module group (9) common working chamber closable with respect surroundings, in particular gas-tight manner, at least one (5) connected chamber, seal-forming movement moving and characterised that comprises reduction (4) reducing faces manner. further corresponding method following sequence: (9), being from into faces.
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