作者: Richard W. Wensel
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摘要: The invention provides a unique method and apparatus for removing flash or other contaminants from an electronic package such as encapsulated semiconductor device by exposing the to plasma gas. In preferred embodiment, gas cleaner is provided with reaction chamber used house during deflashing procedure. Plasma supplied on surfaces of device. these successfully removes excess encasing material contaminants. may be process steps (e.g., etching) employed fabrication manufacture semi conductor