Mold flash removal process for electronic devices

作者: Srikanth Narasimalu , Premkumar Jeromerajan

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摘要: A method is provided for removing excess encapsulation material from unmolded surfaces of a molded substrate including semiconductor packages by utilizing an acid solution. The comprises the steps mounting to holding device with facing source supplying solution, contacting solution sufficient time remove while substantially avoiding contact thereof, and thereafter

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