作者: Shin Woong Bang , Jong Tae Kim , Se Young Seo , Hee Young Jun , Jong Pil Lee
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摘要: Disclosed is a ceramic package mounted with crystal oscillator. The structure of the improved in order to reduce its size while minimizing thermal influence wafer on package. oscillator has bottom sheet, buffer sheet disposed periphery and having internal terminals top thereof, supporting formed spaced from terminal at designated interval lib covering for sealing portion receiving wafer.