De-packaging process for small outline transistor packages
作者： Hiep V. Nguyen , Henry Acedo , Kevin C. Weaver
DOI:
关键词:
摘要: A method to de-packaging a semiconductor device access and test the die within package. The involves initially removing molding compound from first surface of package expose underlying attach pad mask is then formed over attach-pad. An etching solution subsequently introduced through an opening in etch away pad. Once complete, film removed. ohmic contact on exposed back die. used ground so that electrical circuitry will operate properly. grounded, can be electrically tested debugged.
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