Method and apparatus for decapping integrated circuit packages
作者： Ming Hui Hong , Zhihong Mai , Wen Dong Song , Kok Tong Thiam , Chye Eng Soh
DOI:
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摘要: The invention relates to a method and apparatus for decapping integrated circuit packages. involves irradiating an IC package with laser radiation, typically in the UV-IR spectra of short pulse duration. irradiation results ablation molding compound. also provides real-time monitoring process control fluid-flow removal debris. Using invention, can be performed without causing damage internal structure. Furthermore, liquid prevent oxidization compound by ambient air.
google.co.uk 参考文章(11)
Robert K. Lowry, Laser decapsulation method ,(2009)
Yong Feng Lu, Teck Seng Low, Daniel Siu Hung Chan, Pulse laser induced removal of mold flash on integrated circuit packages ,(1995)
Joe W. Hodges, Packaging for bare dice employing EMR-sensitive adhesives ,(1997)
Masahiro Takasaka, Hirokazu Inoue, Mamoru Sawahata, Takashi Hosokawa, Koichi Watanabe, Method and apparatus for removing an electronic component from a board ,(1993)
Robert K. Lowry, Decapsulating method and apparatus for integrated circuit packages ,(1999)
Joe G. Durand, David R. Disko, Decapping machine for packaged integrated circuits ,(1992)
Louis H. Liang, Design and sealing method for semiconductor packages ,(1992)
Hiep V. Nguyen, Henry Acedo, Kevin Weaver, Smith J. Johnson, Backside IC device preparation process ,(2000)
Jeffrey D. Birdsley, Brennan V. Davis, Rosalinda M. Ring, Rama R. Goruganthu, Michael R. Bruce, Substrate removal using thermal analysis ,(1999)
Shigeru Unami, Satoshi Uenosono, Yukiko Ozaki, Die lubricant and iron-based powder mixture for warm compaction with die lubrication, and processes for producing high-density iron-based green and sintered compacts ,(2000)