Semiconductor failure analysis tool

摘要: Systems and methods for removing material from a packaged electronic device of the type encapsulated with protective that forms an outer surface device. An exemplary system includes stage placing in first position receiving laser radiation to remove by ablation, second viewing one or more features along optical is configured provide exterior image, including exposed device, while remains position. A displays captured image interior surface, overlayed simultaneous both images so feature present can be viewed relation image. The combination used define region removal laser. In associated method provided, surface. One are on stage, providing combined defined decapsulation based relative feature.