Method of enabling a circuit board analysis
作者： Pedro R. Ubaldo , Leilei Zhang
DOI:
关键词:
摘要: A method of enabling a circuit board analysis is disclosed. The comprising removing portion the on first side opposite second having an integrated package; from performing dye mapping to analyze bonds between package and board; package.
lens.org 参考文章(17)
Toshiyuki Motooka, Syuichirou Takahashi, Jouji Fujimori, Kunio Kodama, Tatsuharu Matsuda, Test board for testing a semiconductor device and method of testing the semiconductor device ,(1995)
Fred Khosropour, Ahmad Ghaemmaghami, Topside analysis of a multi-layer integrated circuit die mounted in a flip-chip package ,(1998)
Hiep V. Nguyen, Henry Acedo, Kevin C. Weaver, De-packaging process for small outline transistor packages ,(2005)
John D. Sylvestri, Patrick J. McGinnis, Manuel J. Villalobos, Richard W. Oldrey, Darrell L. Miles, Apparatus and method for single die backside probing of semiconductor devices ,(2004)
Isaiah McDonald, Malcolm P. Cambra, Walter J. Rowe, Backside failure analysis of integrated circuits ,(2003)
David R. Hembree, Derek Gochnour, Warren M. Farnworth, Alan G. Wood, Salman Akram, Carrier and system for testing bumped semiconductor components ,(1998)
David R. Hembree, Warren M. Farnworth, Alan G. Wood, Method and apparatus for testing an unpackaged semiconductor die ,(1992)
Su-Shun Zhang, Wen-Jun Pan, Testing device for printed circuit boards ,(2005)