CAD tools for area-distributed I/O pad packaging
作者： R. Farbarik , Xiaowen Liu , M. Rossman , P. Parakh , T. Basso
关键词:
摘要: The use of area interconnect packaging in high frequency microprocessors is motivated by its high-bandwidth and good power distribution capability. An MCM scheme based on area-distributed I/O pads serves as the foundation PUMA project at University Michigan. Area facilitates counts, shorter routes, smaller rails, better thermal conductivity, all which are important clock-rate digital systems. This paper introduces recently developed CAD tools that aid design flip-chip area-interconnected integrated circuits. permit designer to place route bond dictated layout microprocessor. System level issues, such adequate placement pad buffers, addressed. system includes analysis, floorplanning, routing tools.
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