Substrate polishing apparatus and substrate polishing method
作者： Tatsuya Kohama , Norio Kimura , Makoto Akagi
DOI:
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摘要: A substrate polishing apparatus wherein a semiconductor is held by top ring 10-2 or 11-2 and pressed against surface of table 10-1 10-2. to be polished the relative movement between surface. The includes pressing force changing mechanism for substrate, seed number revolutions and/or table, control mechanism. performs through plural processes on while revolutions.
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