Temperature control of chemical mechanical polishing
作者： Thomas H. Osterheld , Stephen Jew , Jimin Zhang , Kun Xu
DOI:
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摘要: A chemical mechanical polishing apparatus including a platen for holding pad having surface, subsystem substrate and the surface together during step, temperature sensor oriented to measure of wherein accepts measured by is programmed vary process parameter in response temperature. In an aspect, fluid delivery system transporting from source controller which operation controls transported system.
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