Effect of volume in interfacial reaction between eutectic Sn-Pb solder and Cu metallization in microelectronic packaging

摘要: The Sn-3.5Ag-0.5Cu (wt.%) is the most promising replacement for eutectic tin-lead solder alloy. Here, an investigation has been carried out to compare interfacial reactions of Cu pad a ball grid array (BGA) substrate with molten Sn-3.5% Ag-0.5% having different volumes. Two sizes BGA balls were used: 760-µm and 500-µm diameter. Scanning electron microscopy (SEM) was used measure consumed thickness also intermetallic compound (IMC). soldering reaction at 230°C, 240°C, 250°C 1 min, 5 10 20 min. consumption much higher Sn-Ag-Cu volume. On other hand, mean intermetallics smaller volume thicker than that bigger balls. Cu3Sn observed interface between Cu6Sn5 IMCs longer reflow both Larger in bulk A simplistic theoretical approach find amount by measurement from form on interface.