Effect of solder volume on interfacial reactions between Sn3.5Ag0.75Cu solder balls and cu pad
作者： Luwei Liu , Mingliang Huang
DOI: 10.1109/ICEPT.2010.5582332
关键词:
摘要: This study focused on the effect of solder volume interfacial reaction between Sn3.5Ag0.75Cu balls and Cu pads PCB after various reflow soldering times. The diameters were 200, 300, 400 500 µm, respectively, opening diameter was 250 µm. ratio for µm approximately 1:4:8:16. intermetallic compound (IMC) common scallop-type 6 Sn 5 . thickness IMC layer obviously thicker smaller ball same reflowing times from 1 to 5. After first reflow, 200 4.39 compared that 3.15 ball. average grains significantly larger than bigger one 5.23 4.22 Both increased with increasing time. ratios all four kinds varied 1.5, which showed a vivid growth perspective 3 dimensions. Based data experiment, dissolution kinetics pad can be simulated.
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