Diffusion kinetics and mechanical behavior of lead-free microbump solder joints in 3D packaging applications
作者： B. S. S. Chandra Rao , V. Kripesh , K. Y. Zeng
DOI: 10.1109/ECTC.2011.5898498
关键词:
摘要: … commercial solders for the reflow bonding process due to their … total IMC thickness for Sn/Cu solder joints of different sizes … hardness of Cu3Sn in the 70μm Cu/ SnAgCu/Cu joint. Fig.12 …
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