摘要: An improved semiconductor package is provided wherein the mounting pad for made from a material selected group consisting of aluminum nitride, diamond, alumina, and boron nitride.
O Itami Works Miyake, Masaya C, Akira C, Hitoyuki C, O Itami Works Sasame, O Itami Works Sakanoue, O Itami Works Yushio, O Itami Works Tekeuchi, Yasuhisa C, Hisao C, O Itami Works Yamakawa, Member for semiconductor apparatus ,(1988)