Buckling and Delamination of Ti/Cu/Si Thin Film During Annealing
作者： Qijing Lin , Shuming Yang , Weixuan Jing , Changsheng Li , Chenying Wang
DOI: 10.1007/S11664-014-3238-7
关键词:
摘要: In this paper, the formation of buckling and delamination sandwiched stacking Ti/Cu/Si thin film are investigated. The crystallization structures, composition Cu/Ti films, surface morphology measured during annealing. results show that solid-phase reaction between Cu Ti occurs at interface. Buckling is initiated in annealed 600°C. volume expansion promotes further produces microcracks. With increasing expansion, there cavities formed middle layer when annealing temperature up to 700°C. Finally, delaminated from substrate.
springer.com
harvard.edu
researchgate.net 
sci-hub.se 参考文章(24)
Lin-Hai Tian, Bin Tang, Dao-Xin Liu, Xiao-Dong Zhu, Jia-Wen He, Interfacial reactions during IBAD and their effects on the adhesion of Cr–N coatings on steel Surface & Coatings Technology. ,vol. 191, pp. 149- 154 ,(2005) , 10.1016/J.SURFCOAT.2004.03.028
Rwei-Ching Chang, Thermoelastic solutions for anisotropic cracked thin films Thin Solid Films. ,vol. 519, pp. 3225- 3235 ,(2011) , 10.1016/J.TSF.2011.01.097
A Skarmoutsou, C A Charitidis, A K Gnanappa, A Tserepi, E Gogolides, Nanomechanical and nanotribological properties of plasma nanotextured superhydrophilic and superhydrophobic polymeric surfaces Nanotechnology. ,vol. 23, pp. 505711- ,(2012) , 10.1088/0957-4484/23/50/505711
R.H. Dauskardt, M. Lane, Q. Ma, N. Krishna, Adhesion and debonding of multi-layer thin film structures Engineering Fracture Mechanics. ,vol. 61, pp. 141- 162 ,(1998) , 10.1016/S0013-7944(98)00052-6
J.W. Hutchinson, M.D. Thouless, E.G. Liniger, Growth and configurational stability of circular, buckling-driven film delaminations Acta Metallurgica Et Materialia. ,vol. 40, pp. 295- 308 ,(1992) , 10.1016/0956-7151(92)90304-W
A. Agwai, I. Guven, E. Madenci, Crack propagation in multilayer thin-film structures of electronic packages using the peridynamic theory Microelectronics Reliability. ,vol. 51, pp. 2298- 2305 ,(2011) , 10.1016/J.MICROREL.2011.05.011
TzD Uzunov, SI Lambov, StP Stojanov, Kinetics of solid-phase interactions in thin-film Cu/Ti system with an excess of Ti Vacuum. ,vol. 46, pp. 61- 65 ,(1995) , 10.1016/0042-207X(95)00028-3
O Piétrement, E Jallot, AFM mechanical mapping at the interface between a bioactive glass coating and bone Nanotechnology. ,vol. 13, pp. 18- 22 ,(2002) , 10.1088/0957-4484/13/1/304
Huabin Wang, Jiecai Han, Shanyi Du, Derek O. Northwood, Reaction Synthesis of Nickel/Aluminide Multilayer Composites Using Ni and Al Foils : Microstructures, Tensile Properties, and Deformation Behavior Metallurgical and Materials Transactions A-physical Metallurgy and Materials Science. ,vol. 38, pp. 409- 419 ,(2007) , 10.1007/S11661-006-9066-5
Tzanko Dimitrov Uzunov, Stojan Petrov Stojanov, Sashko Ivanov Lambov, Thin films of intermetallic Cu/Ti compounds and their possible uses Vacuum. ,vol. 52, pp. 321- 325 ,(1999) , 10.1016/S0042-207X(98)00312-1