Surface mounting pin grid arrays
作者： Jacques Leibovitz , Voddarahalli K. Nagesh , Peter F. Dawson , Shirley B. Dawson executor by
DOI:
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摘要: The present invention is a double headed pin for electrically interconnecting PGA substrate carrier to surface mount printed circuit board. pins provide stronger interconnection the conductive pads on increase in contact and soldering wetting area makes interconnections more durable.
lens.org 参考文章(3)
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Jean-Jacques M. Rieu, Andre Sanchez, Philippe Raout, Francois J. Granier, Method of fabricating an electronic interconnection ,(1992)