High density ceramic BGA package and method for making same
作者： Nagesh K. Vodrahalli
DOI:
关键词: Materials science 、 Metallurgy 、 High density 、 Ball grid array 、 Tungsten 、 Metal 、 Thermal expansion 、 Copper 、 Ceramic 、 Molybdenum
摘要: A ceramic substrate for an integrated circuit package comprising a mixture of MgO and glass, where the material has coefficient expansion greater than about 5 PPM/° C. less 16 In one embodiment, includes low temperature composition glass which sinters in range 600-1400° C., is provided with metal traces selected from group consisting essentially copper, silver, gold alloys thereof. The preferably 30-80 percent by weight, 900-1100° another high 1400-1800° wherein 8 this other molybdenum, tungsten, molymanganese, thereof are provided, 50-99 weight and, more preferably, 85-92 weight.
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